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Custom profile, plastic heat exchanger system

IP.com Disclosure Number: IPCOM000015303D
Original Publication Date: 2001-Nov-18
Included in the Prior Art Database: 2003-Jun-20

Publishing Venue

IBM

Abstract

Disclosed is a device that takes advantage of the natural cavity formed by gas-assisted, plastic injection molding. The cavity can be filled with a liquid or gas to transport heat from point to point. Common molding techniques can be used to form customized shapes and sizes to fit a wide variety of applications.