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The top structure and process of Vacuum Pad for Solder Ball Locate & Laser Reflow (SBL2R) machine

IP.com Disclosure Number: IPCOM000015663D
Original Publication Date: 2002-Mar-14
Included in the Prior Art Database: 2003-Jun-20

Publishing Venue

IBM

Abstract

The top structure and process of Vacuum Pad for Solder Ball Locate Laser Reflow (SBL2R) machine Solder Ball Locate Laser Reflow (SBL2R) Machine is an equipment to connect a Head to an Integrated Lead Suspension (ILS) by soldering in Head Gimbal Assembly (HGA) process (Fig.1). To pick up, carry and locate solder balls accurately onto joints which is composed of pad of ILS and Head as a 90-degree angle, a tool called Vacuum Pad is used, which has the key structure shown as follows (Fig.2). Slider ILS pad