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Plate Fin Heat Sink with Embedded Thermally Conductive Rods Disclosure Number: IPCOM000015671D
Original Publication Date: 2002-May-21
Included in the Prior Art Database: 2003-Jun-20

Publishing Venue



Heat dissipated from electronic modules continues to increase. Thermal engineers, therefore, are always looking to improve the thermal performance of air cooled heat sinks. Disclosed herein is a heat sink with improved thermal performance. The performance improvement is realized by the presence of thermally conductive rods that break up the air boundary layer normally established in plate fin heat sinks. Additionally, since the rods are conductive and are thermally connected to the fins, the surface area for heat transfer is also increased. Figure 1 shows an isometric view of the plate fin heat sink with embedded thermally conductive rods. The heat sink portion of the device is made of a high thermal conductivity material such as copper or aluminum, and is built using known heat sink manufacturing techniques with one notable addition. An array of holes (staggered or in line) are produced within the plate fins as shown in Figure 2. With the heat sink in its assembled state the clearance holes line up so that straight metal solid rods can be inserted as seen in Figure 1. As with the heat sink, the rods are to be made of a high thermal conductivity material such as copper or aluminum. The holes and rods can be of any cross section and orientation; the more notable ones are circular (shown in the figures), square/diamond, and elliptical. The rods are to be in good thermal contact with the heat sink fins. This can be accomplished by press/shrink fitting or metallurgical bonding the rods to the fins. Although not shown, the top portion of the heat sink can be covered so that, with proper ducting, flow can be restricted to flowing solely through the heat sink. Embedded Rod 1