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Structure and method for Via capped RFP

IP.com Disclosure Number: IPCOM000015760D
Original Publication Date: 2002-Jun-01
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue

IBM

Abstract

Two strucure and method for via capped RFP are shown as the following; 1. Via capped RFP structure made by using trepaning mode of laser drill machine Trepaning mode can make fig.1 like vias; Process : fig. 1 (a) fig. 1 (b) fig.1 (c) fig.2