Browse Prior Art Database

Novel designs for increased solder volumes for flip chip attach

IP.com Disclosure Number: IPCOM000015767D
Original Publication Date: 2002-Apr-01
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue

IBM

Abstract

IBM Invention Disclosure (YOR8-1999-0319) Title of Invention Novel designs for increased solder volumes for flip chip attach FIELD OF INVENTION