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Avoding moisture condensation on refrigeration cooled MCMs (T-Rex type design) exposed to ambient air

IP.com Disclosure Number: IPCOM000015818D
Original Publication Date: 2002-May-21
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue

IBM

Abstract

The problem with refrigeration cooled MCMs is that if the MCM outer wall temperature goes below the dew point, condensation will occur and corrode the MCM pins that connect the MCM ceramic substrate to the mother board. A good MCM design would avoid temperatures below the dew point, but under extreme conditions, the MCM could happen to be cooler than the dew point. The proposed invention ensures that moisture condensation is avoided even under extreme ambient conditions when the MCM temperature happens to go below the dew point of the ambient. Air deflector Air-flow duct Finned heat sink