Browse Prior Art Database

Solvent and Aqueous Debonding and Cleaning MR Heads on Tape Disclosure Number: IPCOM000015878D
Original Publication Date: 2002-Aug-17
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue



The invention described in this disclosure is of particular utility in the single slider process. A process had to be developed for imparting an air-bearing pattern to individual sliders and successfully debonding and cleaning the sliders. To remove individual sliders from a carrier, the process of debonding and cleaning that is required with existing commercial equipment is extremely limited due to the increased requirements of adhesive/epoxy/planarization materials encapsulating individual single MR devices. Thus the development of schemes for debonding and cleaning of individual sliders is of utmost importance. Current debond and cleaning processing is performed in chip trays, product trays or cleaning and debonding equipment fixturing. The basic drawbacks of this technology are that the product rubbing on the fixturing causes large volumes of particulate generation to be deposited on the product, metal and tray material pick-up on the product, alcohol staining (bluish stains that are un-removable), brownish ultrasonic burns (visually rejectable) and surrounding the product, thereby preventing efficient fluid flow and mechanical cleaning of the product. Debonding and cleaning on tape provides mechanical and fluid cleaning on 5 sides of the product at one time while securely holding it in place. This allows for complete cleaning on sides of the product which in the past, was one half cleaned during one side of the cleaning process and half cleaned on the other side during the opposite side's cleaning process. It also eliminates the rubbing of product against product, fixtures and trays, reducing the amount of particulate contamination, chips and crack damage and general handling damage. Alcohol staining and ultrasonic burning should be reduced because it exposes the product to full fluid flow and runoff, quicker drying and more efficient contamination removal. This disclosure describes a method by which single MR heads or other individual electronic chips can be held during solvent and aqueous cleaning and debonding with tape films, thereby providing heads or chips with exceptionally low amounts of contamination. This invention requires the following elements: Tape film that can withstand at a minimum the following solvents: NMP, IPA, NPA, acetone, MC, MEK and HFE/HFC Tape film that can withstand surfactant spiked DI H2O Tape film that can withstand the solvents and aqueous fluids above at elevated temperatures to 140C Tape film that can withstand 100C hot gas (most notably DI H2O vapor, N2 and CDA (clean dry air)) Tape film that maintains its dimensional tolerance during the processing of product at the above conditions Tape film's adhesive that can withstand at a minimum the following solvents: NMP, IPA, NPA, acetone, MC, MEK and HFE/HFC Tape film's adhesive that can withstand surfactant spiked DI H2O