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Thermally enhanced profile for cavity down plastic package Disclosure Number: IPCOM000015906D
Original Publication Date: 2002-Sep-01
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue



The current cavity down package is using a flat Nickel plated Copper heat spreader, the idea is to increase the thermal performance of this package modifying the profile of this Copper slug. An increased surface for thermal exchange is the result, within a specific embodiment the creation of channels with differentiated dimension of the grooves along the flow direction increases the air flow bringing the performance of the package to an higher level. Creating a series of channels within the Copper Heat slug embedded within the cavity down package by etching or machining. These channels increase the surface area of contact between the airstream and the copper slug thus improving heat dissipation. By aligning the channels perpendicular to the air flow, turbulence is also increased thus further improving heat transfer. Further, the top heat slug may be open to air, or may be flat with an additional heatsink attached to the top of the package. Usually the only way to remove the heat is to increase the speed of the forced air for cooling or to apply a tall heatsink on top of the Copper slug. Both solutions are not always compatible with the system design/configuration. Section Air Flow direction