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Thermal Cooling Fan design w/thermal conductive sheet for Notebook PC

IP.com Disclosure Number: IPCOM000016247D
Original Publication Date: 2002-Oct-30
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue

IBM

Abstract

Disclosed is a device for improving CPU Temperlature on sub note P.C Thermal rubber is contacted at the keyboard plate btm by unifying to heatsink. For the reason, heat resistance of Heatsink was improved, and MPU temperature has been improved. It is enabled to adjust to various heat resistance by changing the thickness of rubber to unify, and it can make arbitrary heat resistance.(Fig.1) Heatpipe is installed, an improvement of heat conduction efficiency can be expected by installing thermal rubber on it. The inhalation(Flow) resistance to Fan can be reduced by making the form of Thermal rubber circular, and cooling effect can be improved. According to the result of an experiment, five rubbers and arrangement checked that it is the optimum. Power applied to the keyboard by arranging rubber to 5 places can be diffused from 1 place.(Fig. 3) There is no affecting the feeling of click in this arrangement. (Fig. 2) (Fig. 3) Unified to heatsink.(Fig.1) Thermal rubber is installed by recess.