Browse Prior Art Database

Flip Chip Plastic-Ceramic Module

IP.com Disclosure Number: IPCOM000016286D
Original Publication Date: 2002-Dec-31
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue

IBM

Abstract

Flip Chip Plastic - Ceramic Module and Plastic - Ceramic MCM incorporates a ceramic connection to the semiconductor chip with a reduced size ceramic body. The ceramic body is then attached to a plastic substrate with BGA balls on the underside of the plastic substrate. One incorporation has multiple ceramic bodies on a single plastic substrate.