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Structures and Methods of creation planar structures in mixed density laminate structures

IP.com Disclosure Number: IPCOM000016348D
Original Publication Date: 2002-Oct-30
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue

IBM

Abstract

Following is a structure that allows a uniform PWB composite thru a design function of adding and subtraction copper per internal plane in non critical areas within each plane. This would allow for the overall reduction of overall thickness variations that currently occur with product that needs high density interconnection's in small area of the product. This will then allow for the Interposer to attach to the surface of the product with a improved planar surface.This would allow the designers to gain a flatter surface to connect non soldered lead interposers to the board surface. P roduct w ithout Im provem ents P roduct w ith Im provem ents Module