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Single sided Selective LGA Disclosure Number: IPCOM000016349D
Original Publication Date: 2002-Oct-04
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue



The present invention provides a structure where the high aspect ratio plated through hole (10:1) is reinforced with a filler material that prevents etchant solutions from entering the pth and the finish Ni-Au is only plated on the top surface and not entering the pth. A pictorial of such structure is shown in Figure (below). where single side hard gold plating structure of LGA in high aspect ratio boards without Ni/Au plating in neighboring PTHs is provided . Such a method and structure eliminates post assembly opens in PTH, high scrap of assembled boards, escapes of such defects in the field eliminates field fails associated with such defects. The following are experiemntal results that demonstrate the concept and the resulting structure. Resin filled vs SM filled, sample size 16/cell