Browse Prior Art Database

CEC Shipping/Install Packaging System

IP.com Disclosure Number: IPCOM000016412D
Original Publication Date: 2002-Dec-11
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue

IBM

Abstract

Today’s CMOS servers (Z series) have an upper and lower location for its central electronics complex (CEC) and I/O assemblies. The packaging system described (7335603) in this disclosure is used to safely transport this assembly to customer sites to perform upgrades (MES’s) and FRU (field replaceable unit) repairs in both the upper (in conjunction with a portable hoist) and lower location of the server frame. As a container for shipment, the packaging system is utilized by removing the plywood tube (2) /corrugated cap (1) from the pallet base. This base consists of a pallet section (6,7) and a plastic plate (5) with a steel cable sling (4) attached. The assembly is held to this pallet/plate with two machined wood hold downs (3) that are screwed in place. To finish the packaging, the tube/cap is placed back over the restrained assembly and held in place with two metal bands. 1 2