Bias Springs Providing Mechanical Support for OSA Carrier Assemblies During Manufacture of Optical Transceivers.
Original Publication Date: 2002-Dec-13
Included in the Prior Art Database: 2003-Jun-21
A method and structure is provided to support OSA Carrier Assemblies during manufacture to prevent damage to the fragile electrical leads of the OSA's before they are attached to the printed circuit board. A flat, low profile leaf spring will be placed between the transceiver base and the bottom surface of the OSA Carriers. The spring is also used to set the correct height of the OSA heat slug against the top cover.