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Bias Springs Providing Mechanical Support for OSA Carrier Assemblies During Manufacture of Optical Transceivers. Disclosure Number: IPCOM000016419D
Original Publication Date: 2002-Dec-13
Included in the Prior Art Database: 2003-Jun-21

Publishing Venue



A method and structure is provided to support OSA Carrier Assemblies during manufacture to prevent damage to the fragile electrical leads of the OSA's before they are attached to the printed circuit board. A flat, low profile leaf spring will be placed between the transceiver base and the bottom surface of the OSA Carriers. The spring is also used to set the correct height of the OSA heat slug against the top cover.