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Method for Encapsulation of Interconnect Thru Mold Packages

IP.com Disclosure Number: IPCOM000016493D
Publication Date: 2003-Jun-25

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a two-step process to encapsulate Interconnect Thru Mold (ITM) packages. Benefits include not adding any direct mechanical stresses to the package.