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Disclosed is a method that uses a thermoformed PVC tray and lid for packaging, handling, and shipping Pentium 4 processors for distribution to customers. Benefits include protection of the processor pins.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
61% of the total text.
Method of Packing and Containing Pentium
4 Processors for Handling and Shipping
Disclosed is a method that uses a thermoformed PVC tray and lid for packaging, handling, and
shipping Pentium 4 processors for distribution to customers. Benefits include
protection of the processor pins.
Because Intel is the
only company shipping Pentium 4 processors, this is a unique concept with no
prior state of the art.
The disclosed method
uses a thermoformed PVC tray and lid. Because the pins of the processor are
very susceptible to bending, extensive research and development went into
creating a cavity/compartment for containment. This cavity/compartment protects
the processor from bending during handling, and from shock and vibration in the
manufacturing and distribution environment.
The processor sits
in the tray (Figures 5, 10), IHS/die face down and pins up, contacting and
locating the processor substrate in the four corners only (Figures 5, 7, 11).
The lid (Figures 1, 12) applies downward pressure onto the substrate on the
centerlines (Figures 1,3, 13) and also providing a “dome” (Figures 4, 15) over
the pins, such that there is space between the top of the pins and the top of
The action of the
tray and lid (Figure 14) provide a cavity where the pins are free floating, but
the processor is held rigidly within the cavity/compartment. Because the pins
are free floating, they cannot be bent during handling, or damaged by shock and