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A Flexible Die-Die Interconnect Based on Conductive Polymers for Multi-Die CSPs

IP.com Disclosure Number: IPCOM000016802D
Publication Date: 2003-Jul-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a flexible ribbon to connect dies in multi-die CSP packages. The ribbon is a composite of polyimide base material and conductive polymer traces. The ribbon is connected to the bond pads using conductive self-assembled mono layers (SAMs). Benefits include an increase in package assembly throughput.