A Flexible Die-Die Interconnect Based on Conductive Polymers for Multi-Die CSPs
Publication Date: 2003-Jul-16
The IP.com Prior Art Database
Disclosed is a method that uses a flexible ribbon to connect dies in multi-die CSP packages. The ribbon is a composite of polyimide base material and conductive polymer traces. The ribbon is connected to the bond pads using conductive self-assembled mono layers (SAMs). Benefits include an increase in package assembly throughput.