Publishing Venue
The IP.com Prior Art Database
Abstract
Disclosed is a method for a through-hole mount (THM) land grid array (LGA) socket. Benefits include improved performance, improved ease of manufacturing, and improved design simplicity.
Method for a through-hole mount LGA socket
Disclosed is a method for a through-hole mount (THM) land grid
array (LGA) socket. Benefits include improved
performance, improved ease of manufacturing, and improved design simplicity.
Background
� � � � � A fundamental challenge with electronic packages is to deliver
high-performance power delivery and high performance, high pin count I/O
through a microprocessor socket with a low component cost. Surface-mounted LGA
sockets are a conventional solution (see Figure 1). The LGA socket
contains stamped metal contacts retained within a plastic housing. The contacts
interface with the printed circuit board (motherboard) and the package through
a sustained compressive load between the package and the motherboard. Lands on
the package and motherboard are gold plated to prevent oxidation at the
electrical interfaces. However, lower component cost and improved ease of manufacturing are required.
� � � � � Conventionally, these
problems have been solved by the use of a surface mount technology (SMT) pin
grid array (PGA) socket or a double-compression LGA socket.
�
General description
� � � � � The disclosed method is an LGA socket utilizing
through-hole mount leads for interconnection to a motherboard. The key elements
of the method include:
• � � � � A socket utilizing
both a compression interconnect at the socketable interface (LGA) and a THM
connection to a printed circuit board
Advantages
� � � � � The disclosed method
provides advantages, including:
• � � � � Improved performance
due to lower electrical resistance
• ...