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Mixed Board Pad Size Design Concept for Fine Pitch Flip-Chip Packages

IP.com Disclosure Number: IPCOM000016814D
Publication Date: 2003-Jul-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses an innovative fine pitch board design (i.e. equal to, or less than, 1mm ball-pitch) to decrease solder fatigue failure rate. Benefits include increased performance reliability.