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Method for threaded mounting holes in an IHS for a FCBGA package

IP.com Disclosure Number: IPCOM000016815D
Publication Date: 2003-Jul-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for threaded mounting holes in an integrated heatsink (IHS) for a flip-chip ball grid array (FCBGA) package. Benefits include improved reliability and improved ease of assembly.