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Disclosed is a method for threaded mounting holes in an integrated heatsink (IHS) for a flip-chip ball grid array (FCBGA) package. Benefits include improved reliability and improved ease of assembly.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
67% of the total text.
Method for threaded mounting holes in an IHS for a FCBGA
Disclosed is a method for threaded mounting holes in an
integrated heatsink (IHS) for a flip-chip ball grid array (FCBGA) package. Benefits include improved reliability and improved ease of
� � � � � Conventional FCBGA package data shows high
solder join reliability (SJR) issues at package corners when the heatsink is
applied with force (load), which increases as packages require high power
dissipation. As a result, a new assembly methodology is required to ensure the
thermal requirement is met while an acceptable SJR level is maintained.
� � � � � The conventional
solution is to fasten the heatsink by using a printed circuit board (PCB) as
the foundation. Before loading with heatsink clip force, the PCB board is flat
and the chipset solder ball is not under stress. When the heatsink clip is
applied, force is placed on the chipset. The heatsink clip forces the board to
flex and high stress occurs on the solder ball located at the chipset corner
(see Figure 1).
� � � � � To prevent failure,
no solder ball is placed at the package corner and under the die shadow.
� � � � � The disclosed method
is threaded mounting holes in an IHS on an FCBGA package without introducing
stress on the second-level interconnect solder joint. Threaded mounting holes
accommodate screws that directly attach the heatsink and the chipset with an
IHS from the top (see Figures 2 and 3). The torque from ti...