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Polysilicon Planarisation

IP.com Disclosure Number: IPCOM000016947D
Original Publication Date: 1999-Apr-01
Included in the Prior Art Database: 2003-Jul-21

Publishing Venue

Siemens

Related People

Authors:
Thomas Morgenstern Michael Schmidt [+details]

Abstract

The planarisation of the product is normally done either by CMP or in DPS chambers, due to their higher removal or etch rates compared with MxP Centura chambers. Due to the numerous planarisation steps during the production it is the main topic to have several possibilities for the removal of polysilicon before starting the recess processes. The uniformity of the resulting product have to be better than 3%, before starting the recess. Unfortunately MxP Centura chambers exhibit only 8% of uniformity. The reason seems to be the negative influence of the extended cathode within these chambers compared to the oxide chambers.