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Disclosed is a method for a polytetrafluoroethylene/dielectric coating to prevent electrical shortage between bonding wires. Benefits include improved yield.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
75% of the total text.
Method for a polytetrafluoroethylene/dielectric coating to
prevent electrical shortage between bonding wires
Disclosed is a method for a polytetrafluoroethylene/dielectric
coating to prevent electrical shortage between bonding wires. Benefits include improved yield.
� � � � � Bonding-wire sweep
has been observed in package assembly. It is caused by the molding compound
flow. When the bond pitch is small or
the bonding wire is very long, the mold compound flow can cause bonding-wire
sweep. The bonding wires can touch each other, resulting in electrical
shortage. The conventional solution is to reduce the bonding-wire length
and increase the bonding-wire pitch to prevent the bonding wires from touching
each other and shorting out (see Figure 1).
� � � � � Polytetrafluoroethylene
has been widely used as a dielectric material.
� � � � � The disclosed method
is to spray coat bonding wires with polytetrafluoroethylene or dielectric
materials after the wire bonding process. When the molding compound is injected
into the mold, the longer bonding wires may sweep to touch each other. However,
the polytetrafluoroethylene and dielectric coating prevents the electrical
� � � � � Spray coating the bonding wires with
polytetrafluoroethylene or dielectric materials after the wire bonding process
makes the mold compound material
selection and mold process development easier. Various ranges of mold compound
viscosity and mold flow rates can be accepted without...