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Pad Placement Algorithm for four-sided packages

IP.com Disclosure Number: IPCOM000017502D
Original Publication Date: 2001-Jan-01
Included in the Prior Art Database: 2003-Jul-23

Publishing Venue

Siemens

Related People

Authors:
Ho Chew Choy Paul [+details]

Abstract

The idea of this invention is the development of an algorithm that can quickly perform pad placement for a given IC using T/MQFP packages. The algorithm can be effectively used in a CAD tool for package feasibility analysis performing the very early stage of pad placement for the floorplanning tool. By doing so, it is able to judge in a very early stage of the design if a design can use a particular package and evaluate the costs involved. 1. Conditions for successful placement