Browse Prior Art Database

Method for solder thermal interface materials with high bulk thermal conductivity and low interfacial resistance

IP.com Disclosure Number: IPCOM000018753D
Publication Date: 2003-Aug-06

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for solder thermal interface materials with high bulk thermal conductivity and low interfacial resistance. Benefits include improved thermal performance, improved reliability, and improved design flexibility.