Browse Prior Art Database

Independent Thermoform Processor Cavity

IP.com Disclosure Number: IPCOM000018757D
Publication Date: 2003-Aug-06

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a processor packaging solution that uses a three-piece thermoform comprised of a tray, lid, and processor cavity cover. Benefits include greater process flexibility and product protection with the independent packaging of the heat sink and processor.