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Disclosed is a method that optimizes the copper core of an aluminum fin heat sink for thermal mass and temperature distribution. Benefits include improved reliability and reduced process costs.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
100% of the total text.
A Cost Optimized Thermal Solution for
Disclosed is a method that optimizes the copper core of an
aluminum fin heat sink for thermal mass and temperature distribution. Benefits
include improved reliability and reduced process costs.
The current state of
the art thermal solution is a copper core, aluminum, radial-finned heat sink
(see Figure 1). The device weighs 300g and is attach to the processor by a
mechanical clip. Fifty percent of the weight of the heat sink is in the copper
core. This current configuration is so massive that it can cause solder
joint damage during shock and vibration.
Upon examination, the copper slug has been found to be thermally
inefficient (see Figure 2). The disclosed method reduces the weight of the heat
sink by removing a right conical section of the copper core. This reduces the
weight without effecting the overall temperature distribution or thermal
behavior of the heat sink. Figures 3,4, and 5 show the disclosed method
verified by modeling it using a thermal finite element computer code.
The disclosed method reduces the weight of the heat sink
without effecting the overall temperature distribution or thermal behavior; it
also improves reliability and reduces process costs.