Browse Prior Art Database

LTCC Module Array Transfer Mold Process Improvement Disclosure Number: IPCOM000018884D
Original Publication Date: 2003-Aug-19
Included in the Prior Art Database: 2003-Aug-19

Publishing Venue


Related People

Mark Gerber Nicholas Cheng


The increasing interest for smaller and more integrated wireless solutions has led companies like Motorola to investigate LTCC based module array solutions. Low Temperature Co-fired Ceramics (LTCC) substrates offer a number of benefits when used in RF applications. The primary benefit is the high level of integration that LTCC based modules can provide over the standard organic based solutions. Specifically, the passive components that are used with an integrated module can be embedded into the LTCC substrate to reduce the amount of top surface area required. One application that has utilized LTCC substrates as their electrical interconnect technology is Power Amplifier modules. To ensure tight package case outline tolerances are kept, an array transfer mold may be utilized but there are a number of challenges when implementing this type of encapsulation process.