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Method for solder-column preform extrusion for second-level interconnections

IP.com Disclosure Number: IPCOM000018909D
Publication Date: 2003-Aug-20

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for solder-column preform extrusion for second-level interconnections. Benefits include improved reliability, improved process simplification, improved yield, an improved development environment, and improved cost effectiveness.