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Disclosed is a method that uses a silicone with conductive properties. Benefits include a reduction in Highly Accelerated Stress Test (HAST) and resistivity issues.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
83% of the total text.
Conductive Silicone Interconnect
Material as an Alternative to Solder, Conductive Epoxy, or Other Polymer
Disclosed is a method that uses a silicone with conductive
properties. Benefits include a reduction in Highly Accelerated Stress Test (HAST)
and resistivity issues.
The current state of the art uses an electrically-conductive
epoxy interconnect material, such as a silver-filled epoxy; however, the
moisture sensitivity of this epoxy reduces its material properties and
resistance values over time. Currently, the problem is solved by using these
materials in non-HAST critical areas or in short life span products not
requiring a reliable long life. Figure 1 shows an image of a conductive
adhesive stenciled onto a bond pad.
The disclosed method uses an electrically-conductive
silicone interconnect material to address the issues of HAST and resistivity that
silver-filled epoxies encounter over time. This type of interconnect joint
should be much more resistant to stress testing in general. The material, though not yet invented and
tested, could function in the same manner as an epoxy. Silver flakes can be mixed with a silicone
material, as the flakes are currently mixed with epoxies today. It is expected that the fill weight of the
silver in the silicone would be equivalent in levels to that of epoxies. No figure exists of a silicone that has
conductive filled material, but it would look similar to the image shown in Figure...