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Conductive Silicone Interconnect Material as an Alternative to Solder, Conductive Epoxy, or Other Polymer Interconnect Materials

IP.com Disclosure Number: IPCOM000018911D
Publication Date: 2003-Aug-20

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a silicone with conductive properties. Benefits include a reduction in Highly Accelerated Stress Test (HAST) and resistivity issues.