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Browse Prior Art Database

Method for the stencil printing application of a no-flow underfill material to bond wafers

IP.com Disclosure Number: IPCOM000018941D
Publication Date: 2003-Aug-21

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the stencil printing application of a no-flow underfill material to bond wafers. Benefits include improved functionality, improved process simplification, and improved reliability.