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Method for real-time in-place interface formation detection during wafer bonding

IP.com Disclosure Number: IPCOM000019039D
Publication Date: 2003-Aug-27

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for real-time in-place interface formation detection during wafer bonding. Benefits include improved functionality, in-line monitoring, improved yield, an improved production environment, and improved design flexibility.