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Disclosed is a method for polymeric encapsulation of wire bonding to reduce wire sweep and shorting in stacked-die chip-scale packaging. Benefits include improved design flexibility.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
86% of the total text.
Method for polymeric encapsulation of wire bonding to
reduce wire sweep and shorting in stacked-die chip-scale packaging
Disclosed is a method for polymeric encapsulation of wire
bonding to reduce wire sweep and shorting in stacked-die chip-scale packaging. Benefits include improved design flexibility.
shorting of wire is exacerbated by a long bond length on stacked-die packages.
This problem is conventionally solved by the use of short wire
bonds, which are typically less than 4 mm in length on flash packages. Higher
stacked packages have the capability of surpassing the 4-mm length. The problem
could be addressed by changing the mold material and/or mold process or by
using wire with a thicker diameter.
The disclosed method is the polymeric encapsulation of
wire bonding to reduce wire sweep and shorting in stacked-die chip-scale
packaging. A polymeric encapsulating
material is dispensed over the wire bond prior to mold encapsulation in a
stacked die configuration so that the total height of the package is not
affected. A creative dispense pattern permits the same loop height clearance of
reverse bonds in die-to-die stacking.
affixes wires during the molding of a molded matrix array package (see
covers multiple levels of wire and affixes exceptionally long top die-wire
bonds into a matrix prior to molding (see Figures 2 and 3).
The disclosed method
provides advantages, including: