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Method for polymeric encapsulation of wire bonding to reduce wire sweep and shorting in stacked-die chip-scale packaging

IP.com Disclosure Number: IPCOM000019057D
Publication Date: 2003-Aug-27

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for polymeric encapsulation of wire bonding to reduce wire sweep and shorting in stacked-die chip-scale packaging. Benefits include improved design flexibility.