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Method for a hybrid ceramic/organic flip-chip package for improved thermo-mechanical performance and high-density signal routing

IP.com Disclosure Number: IPCOM000019060D
Publication Date: 2003-Aug-27

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a hybrid ceramic/organic flip-chip (FC) package for improved thermo-mechanical performance and high-density signal routing. Benefits include improved performance.