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Method for die size growth/die-side component placement through an LGA package IHS

IP.com Disclosure Number: IPCOM000019064D
Publication Date: 2003-Aug-27

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for die size growth/die-side component placement through a land-grid array (LGA) package integrated heat spreader (IHS). Benefits include improved performance, improved process flexibility, and improved ease of implementation.