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Method for determining the optimum number of power distribution vias in a package design

IP.com Disclosure Number: IPCOM000019132D
Original Publication Date: 2003-Aug-29
Included in the Prior Art Database: 2003-Aug-29
Document File: 5 page(s) / 67K

Publishing Venue

IBM

Abstract

Disclosed here is a method to determine the optimum number, location and type of vias in a first or second level package design needed to ensure proper power distribution, proper signal current return and signal shielding at a minimum manufacturing cost.