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Method for the PVD of metallic TIM directly onto wafers

IP.com Disclosure Number: IPCOM000019315D
Publication Date: 2003-Sep-10

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the physical vapor deposition (PVD) of metallic thermal interface material (TIM) directly onto wafers. Benefits include improved performance, improved process simplification, and improved cost effectiveness.