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Method for sample preparation using an auto-bonding machine in electrical FI/FA for flash devices after unpackaging

IP.com Disclosure Number: IPCOM000019316D
Publication Date: 2003-Sep-10

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for sample preparation using an auto-bonding machine in electrical failure isolation/failure analysis (FI/FA) for flash devices after unpackaging. Benefits include improved performance and improved yield.