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Method for the direct patterning of Ag films for microelectronics applications using direct light exposure

IP.com Disclosure Number: IPCOM000019318D
Publication Date: 2003-Sep-10

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the direct patterning of silver (Ag) patterned interconnect films for microelectronics applications using direct light exposure. Benefits include improved performance and improved process simplicity.