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Abatement Procedures for Removal of Byproducts from CVD Copper Effluent Stream Disclosure Number: IPCOM000019379D
Publication Date: 2003-Sep-12

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The Prior Art Database


Copper deposition has become one of the most important and most rapidly growing areas in integrated circuit manufacturing. Deposition of copper can be accomplished by several means, one of the most popular is the use of chemical vapor deposition (CVD). However, as in most processes, 100% utilization of the chemical is not possible, and byproducts and unreacted precursor materials exit the process chamber. This is especially important in light of the facts that copper is not generally permitted to escape into the environment, and that simple burn boxes can result in precursor degradation into fluorine containing potentially corrosive compounds that can be environmentally hazardous and damaging to vacuum pumps . As a result, a simple and novel method for capturing the effluent has been developed and is described here.