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Removal of Byproducts from CVD Copper Effluent Streams Disclosure Number: IPCOM000019380D
Publication Date: 2003-Sep-12

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The Prior Art Database


Copper deposition has become one of the most important and most rapidly growing areas in integrated circuit manufacturing. Copper metallization can be accomplished by several means, one of the most popular is the use of chemical vapor deposition (CVD). However, as in most processes, 100% utilization of the chemical is not possible, and by-products and unreacted precursor materials exit the process chamber. This is not only unattractive from the perspective of low utilization of precursor but is also problematic since copper is not generally permitted to escape into the environment. Simple burn box treatment of the effluent can result in precursor degradation into fluorine containing potentially corrosive compounds that can also be environmentally hazardous. To avoid these problems a simple, novel and non-destructive method for capturing copper CVD effluent has been developed and is described here. It avoids pollution from the release of copper and fluorocarbon containing species and allows for the recycle of captured materials.