Solder Caps at the Micro-Via Cavity of a Printed Circuit Board
Publication Date: 2003-Sep-17
The IP.com Prior Art Database
Disclosed is a method that deposits solder paste on top of the micro-via cavities of a printed circuit board (PCB). The solder reflow allows the molten solder to fill the cavities, and upon reflow, form a solid barrel. Benefits include the elimination of solder ball voids and improved drill hole size flexibility.