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Solder Caps at the Micro-Via Cavity of a Printed Circuit Board

IP.com Disclosure Number: IPCOM000019521D
Publication Date: 2003-Sep-17

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that deposits solder paste on top of the micro-via cavities of a printed circuit board (PCB). The solder reflow allows the molten solder to fill the cavities, and upon reflow, form a solid barrel. Benefits include the elimination of solder ball voids and improved drill hole size flexibility.