Laminating by Vapor Phase Reflow
Publication Date: 2003-Sep-24
The IP.com Prior Art Database
The purpose of this disclosure/invention is to respond to the need to produce Insert wire that is lead free. The Electrical/Electronic industires across the globe have recognized the need to reduce/eliminate the lead (Pb) content of ALL soldered connections made in electrical apparatus. This process will allow for the use of available lead free solders to be used in the laminating of our existing SS tapes and insert HST wire.