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Laminating by Vapor Phase Reflow

IP.com Disclosure Number: IPCOM000019658D
Publication Date: 2003-Sep-24

Publishing Venue

The IP.com Prior Art Database

Related People

Paul J. DePietro Christopher A. Craven


The purpose of this disclosure/invention is to respond to the need to produce Insert wire that is lead free. The Electrical/Electronic industires across the globe have recognized the need to reduce/eliminate the lead (Pb) content of ALL soldered connections made in electrical apparatus. This process will allow for the use of available lead free solders to be used in the laminating of our existing SS tapes and insert HST wire.