The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Stackable structure for High Speed Electronic assembly Test measurements

IP.com Disclosure Number: IPCOM000019829D
Original Publication Date: 2003-Oct-01
Included in the Prior Art Database: 2003-Oct-01

Publishing Venue



Disclosed is a method to design and assembling substrates for technology characterization in labs and product development environments. In the specific embodiment for High Speed measurements.