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Copper Electroplate Pre-Anneal Process Optimization to Address Post Copper Polish Defects

IP.com Disclosure Number: IPCOM000019832D
Publication Date: 2003-Oct-01

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses an anneal treatment on the wafer prior to electroplating to correct post-polish defects.). Benefits include improved yield and parametric performance and reliability.