The following operators can be used to better focus your queries.
( ) , AND, OR, NOT, W/#
? single char wildcard, not at start
* multi char wildcard, not at start
(Cat? OR feline) AND NOT dog?
Cat? W/5 behavior
(Cat? OR feline) AND traits
Cat AND charact*
This guide provides a more detailed description of the syntax that is supported along with examples.
This search box also supports the look-up of an IP.com Digital Signature (also referred to as Fingerprint); enter the 72-, 48-, or 32-character code to retrieve details of the associated file or submission.
Concept Search - What can I type?
For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.
Concept search eliminates the need for complex Boolean syntax to inform retrieval. Our Semantic Gist engine uses advanced cognitive semantic analysis to extract the meaning of data. This reduces the chances of missing valuable information, that may result from traditional keyword searching.
Disclosed is a method that uses an in-situ pre-rinse in the plating cell. Benefits include a reduction in integrated defects and an improvement in wetting prior to electroplating.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
100% of the total text.
Implementation of an In-Situ
Pre-Electroplate Deionized Rinse in the Plating Cell
Disclosed is a method that uses an in-situ pre-rinse in the
plating cell. Benefits include a reduction in integrated defects and an
improvement in wetting prior to electroplating.
defects can show up as “pits” on bare test wafers (see Figure 1) or as “integrated
defects” when reviewed on patterned/production wafers. Both defect types are voids down to the
copper barrier seed. A process with a pre-rinse improves wetting and decreases
the number of defects; however, the current state of the art does not use a
pre-rinse process in the plating cell.
The disclosed method uses pressurized deionized (DI) water that sprays a wafer with copper barrier
seed on it (see Figure 2). The
DI water pre-rinse is done in-situ, with the same cell the electroplating is
done in. Process parameters such as rinse time, rinse speed, dry time, and dry
speed are optimized for the best possible wetting. The wafer is rinsed with the
seed facing the rinse process. The orientation of the seed/wafer is arbitrary
(i.e., the seed can be facing up with the spray going down, or vice versa).
The disclosed method reduces a variety of defects on test and
production wafers, and improves wetting prior to electroplating.