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Method for the formation of wafer sawing fiducial marks on the wafer backside to enable backside wafer dicing

IP.com Disclosure Number: IPCOM000019835D
Publication Date: 2003-Oct-01

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the formation of wafer sawing fiducial marks on the wafer backside to enable backside wafer dicing. Benefits include improved functionality, improved process simplicity, and improved yield.