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Next-Generation Lithography Alternative and Low-Cost Process Flow for Nano-feature Resolution Resist Patterning

IP.com Disclosure Number: IPCOM000019836D
Publication Date: 2003-Oct-01

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a process flow for patterning sub 100nm resist features in the absence of conventional exposure tooling. Benefits include improved pattern fidelity and line width roughness.