Dismiss
The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method for wafer bow and stress measurement on patterned production wafer via pattern recognition using a film thickness tool

IP.com Disclosure Number: IPCOM000019838D
Publication Date: 2003-Oct-01

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for wafer bow and stress measurement via pattern recognition using a film thickness tool. Benefits include improved performance and improved through-put time.