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Method for resin-filled copper-plated via structures for three-layer flexible tape substrates

IP.com Disclosure Number: IPCOM000019855D
Publication Date: 2003-Oct-01

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for resin-filled copper-plated via structures for three-layer flexible tape substrates. Benefits include improved functionality, improved process simplicity, and improved reliability.