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Method for a porous heatsink for cooling low-end microprocessors and chipsets under buoyancy-induced flows

IP.com Disclosure Number: IPCOM000019856D
Publication Date: 2003-Oct-01

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a porous heatsink for cooling low-end microprocessors and chipsets under buoyancy-induced flows. Benefits include improved functionality, improved thermal performance, improved performance, and improved reliability.